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Research Paper#Materials Science, MEMS, Thin Films🔬 ResearchAnalyzed: Jan 3, 2026 09:27

Wafer-Scale Integration of High-Scandium AlScN Films

Published:Dec 30, 2025 20:25
1 min read
ArXiv

Analysis

This paper addresses a significant challenge in MEMS fabrication: the deposition of high-quality, high-scandium content AlScN thin films across large areas. The authors demonstrate a successful approach to overcome issues like abnormal grain growth and stress control, leading to uniform films with excellent piezoelectric properties. This is crucial for advancing MEMS technology.
Reference

“The paper reports "exceptionally high deposition rate of 8.7 μm/h with less than 1% AOGs and controllable stress tuning" and "exceptional wafer-average piezoelectric coefficients (d33,f =15.62 pm/V and e31,f = -2.9 C/m2)".”

PermalinkArXiv
Research#llm📝 BlogAnalyzed: Dec 25, 2025 23:26

Titanium Morning News: Regulations on Information Disclosure of Asset Management Products by Banking and Insurance Institutions Released, Effective September 1st Next Year; Guangzhou's First Special Support Policy for the Game E-sports Industry Released; Samsung Electronics Plans to Launch Application Processors with Self-Developed GPUs as Early as 2027

Published:Dec 25, 2025 23:20
1 min read
钛媒体

Analysis

This news compilation from Titanium Media covers a range of business and technology developments in China. The financial regulation update regarding asset management product information disclosure is significant for the banking and insurance sectors. Guangzhou's support for the gaming and e-sports industry highlights the growing importance of this sector in the Chinese economy. Samsung's plan to develop its own GPUs signals a move towards greater self-reliance in chip technology, potentially impacting the broader semiconductor market. The other brief news items, such as price increases in silicon wafers and internal violations at ByteDance, provide a snapshot of the current business climate in China.
Reference

“Samsung Electronics Plans to Launch Application Processors with Self-Developed GPUs as Early as 2027”

Permalink钛媒体
Research#llm🔬 ResearchAnalyzed: Jan 4, 2026 08:25

TEMP: A Memory Efficient Physical-aware Tensor Partition-Mapping Framework on Wafer-scale Chips

Published:Dec 16, 2025 10:06
1 min read
ArXiv

Analysis

This article introduces a research paper on a framework called TEMP designed for efficient tensor partitioning and mapping on wafer-scale chips. The focus is on memory efficiency and physical awareness, suggesting optimization for hardware constraints. The target audience is likely researchers and engineers working on large-scale AI models and hardware acceleration.
Reference

“The article is based on a paper from ArXiv, indicating it's a pre-print or research publication.”

PermalinkArXiv
Research#semiconductor🔬 ResearchAnalyzed: Jan 4, 2026 12:03

Comparative Analysis of Semiconductor Wafer Defect Detection with Image Transformer

Published:Dec 12, 2025 19:03
1 min read
ArXiv

Analysis

This article likely presents a research paper comparing the performance of image transformers for defect detection in semiconductor wafer maps. The focus is on a specific application within the semiconductor industry, utilizing a deep learning approach. The 'ArXiv' source indicates it's a pre-print server, suggesting the work is recent and potentially not yet peer-reviewed. The core of the analysis would involve comparing the accuracy, efficiency, and potentially other metrics of the image transformer model against existing methods or other deep learning architectures.
Reference

“The article would likely include performance metrics such as accuracy, precision, recall, and F1-score to evaluate the effectiveness of the image transformer model. It would also likely discuss the architecture of the image transformer used, the dataset employed for training and testing, and the experimental setup.”

PermalinkArXiv
Research#Semimetals🔬 ResearchAnalyzed: Jan 10, 2026 12:57

Robust Transport in Topological Semimetals Achieved with Atomic Layer Deposition

Published:Dec 6, 2025 05:36
1 min read
ArXiv

Analysis

This research explores advancements in the fabrication of topological semimetals, crucial for future electronic devices. The study's focus on low-resistance transport and robustness against scaling suggests potential breakthroughs in miniaturization and performance.
Reference

“Scale-robust Low Resistance Transport in Atomic Layer Deposited Topological Semimetal Wafers on Amorphous Substrate”

PermalinkArXiv
Research#llm📝 BlogAnalyzed: Dec 29, 2025 07:26

Powering AI with the World's Largest Computer Chip with Joel Hestness - #684

Published:May 13, 2024 19:58
1 min read
Practical AI

Analysis

This podcast episode from Practical AI features Joel Hestness, a principal research scientist at Cerebras, discussing their custom silicon for machine learning, specifically the Wafer Scale Engine 3. The conversation covers the evolution of Cerebras' single-chip platform for large language models, comparing it to other AI hardware like GPUs, TPUs, and AWS Inferentia. The discussion delves into the chip's design, memory architecture, and software support, including compatibility with open-source ML frameworks like PyTorch. Finally, Hestness shares research directions leveraging the hardware's unique capabilities, such as weight-sparse training and advanced optimizers.
Reference

“Joel shares how WSE3 differs from other AI hardware solutions, such as GPUs, TPUs, and AWS’ Inferentia, and talks through the homogenous design of the WSE chip and its memory architecture.”

PermalinkPractical AI