SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains
Published:Dec 30, 2025 21:01
•1 min read
•Toms Hardware
Analysis
SK hynix's investment in a U.S. packaging plant for HBM is a significant move. It addresses a critical weakness in the U.S. semiconductor supply chain by bringing advanced packaging capabilities onshore. The $3.9 billion investment signals a strong commitment to the AI market and directly challenges TSMC's dominance in advanced packaging. This move is likely to reshape the AI supply chain, potentially leading to increased competition and diversification of manufacturing locations.
Key Takeaways
Reference
“SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana.”