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Analysis

This paper investigates the corrosion behavior of ultrathin copper films, a crucial topic for applications in electronics and protective coatings. The study's significance lies in its examination of the oxidation process and the development of a model that deviates from existing theories. The key finding is the enhanced corrosion resistance of copper films with a germanium sublayer, offering a potential cost-effective alternative to gold in electromagnetic interference protection devices. The research provides valuable insights into material degradation and offers practical implications for device design and material selection.
Reference

The $R$ and $ρ$ of $Cu/Ge/SiO_2$ films were found to degrade much more slowly than similar characteristics of $Cu/SiO_2$ films of the same thickness.