Chinese HBM3e Packaging Revolutionizes AI Chip Performance
infrastructure#gpu📝 Blog|Analyzed: Mar 30, 2026 07:30•
Published: Mar 30, 2026 07:25
•1 min read
•cnBetaAnalysis
Chinese companies are pushing the boundaries of AI hardware! The unveiling of advanced HBM3e packaging, capable of 960GB/s bandwidth and designed for 3nm AI chips, signifies a major leap forward in domestic chip technology. This development promises to accelerate AI innovation.
Key Takeaways
- •Chinese company Changjiang Technology has showcased advanced HBM3e packaging.
- •The packaging boasts a 960GB/s bandwidth, optimized for cutting-edge AI chips.
- •The technology is already attracting orders from industry leaders like AMD and NVIDIA.
Reference / Citation
View Original"HBM3e can perfectly fit high-end AI chips with 3nm and below processes, and has already obtained orders from giants such as AMD and NVIDIA."